Delaware | 3674 | 22-3056180 | ||
(State or other jurisdiction
of incorporation or organization) |
(Primary Standard Industrial Classification Number) |
(I.R.S. Employer Identification Number) |
Yoshiki Shimada, Esq. Alan L. Jakimo, Esq. Sidley Austin LLP 787 Seventh Avenue New York, NY 10019 212-839-5300 |
William B. Brentani, Esq. Simpson Thacher & Bartlett LLP 2550 Hanover Street Palo Alto, CA 94304 650-251-5000 |
1
Item 16. | Exhibits and Financial Statement Schedules. |
Exhibit |
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Number
|
Description
|
|||
1 | .1* | Form of Underwriting Agreement. | ||
3 | .1** | Amended and Restated Certificate of Incorporation of the registrant. | ||
3 | .2** | Amended and Restated By-laws of the registrant. | ||
4 | .1* | Form of registrants Common Stock Certificate. | ||
5 | .1* | Opinion of Sidley Austin llp. | ||
10 | .1** | 2001 Stock Option Plan and form of agreements thereunder. | ||
10 | .2** | 2007 Long-Term Incentive Plan. | ||
10 | .3** | Executive Deferred Compensation Plan for the registrant. | ||
10 | .4** | Severance Agreement, dated March 30, 2001, between the registrant and Dennis H. Fitzgerald and Letter Agreement, dated June 27, 2003, between the registrant and Dennis H. Fitzgerald, entered in relation thereto. | ||
10 | .5** | Affiliation Agreement, dated October 3, 2007, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .6 | Distribution Agreement Japan, dated July 5, 2007, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .7 | Distribution Agreement, dated July 5, 2007, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .8 | Sales Representative Agreement, dated July 5, 2007, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .9 | Wafer Foundry Agreement, dated August 1, 2007, between the registrant and Polar Semiconductor, Inc. | ||
10 | .10 | Joint Technology Development Agreement, effective as of September 13, 2007, among Polar Semiconductor, Inc., Sanken Electric Co., Ltd. and the registrant. | ||
10 | .11 | Technology Development Agreement, dated November 6, 2001, between PolarFab, Inc. (now known as Polar Semiconductor, Inc.) and the registrant. | ||
10 | .12 | Technology Transfer Agreement, dated November 30, 2002, between the registrant and Sanken Electric Co., Ltd. | ||
10 | .13** | Letter of Consent/Coexistence Agreement, dated October 3, 2006, between Cadence Design Systems, Inc. and the registrant. | ||
10 | .14** | Lease Agreement, dated August 19, 2003, between Airtight II, LLC and the registrant. | ||
10 | .15** | Contract of Lease, dated October , 2000, between the Government of the Republic of the Philippines and Allegro MicroSystems Philippines, Inc. | ||
10 | .16** | Contract of Lease, dated April 1, 2004, between Allegro MicroSystems Philippines Realty, Inc. and Allegro MicroSystems Philippines, Inc. | ||
10 | .17** | Loan Agreement, dated April 12, 2004, between the registrant and Sanken Electric Co., Ltd. and Memorandum, dated June 30, 2006, entered in relation thereto. | ||
10 | .18** | Loan Agreement, dated July 13, 2005, between the registrant and Sanken Electric Co., Ltd. and Memorandum, dated June 30, 2006, entered in relation thereto. | ||
10 | .19** | Loan Agreement, dated January 26, 2007, between the registrant and Sanken Electric Co., Ltd. | ||
10 | .20** | Loan Agreement, dated October 10, 2003, between Allegro MicroSystems Philippines, Inc. and Equitable PCI Bank. | ||
10 | .21** | Deed of Undertaking, dated October 10, 2003, entered by Allegro MicroSystems Philippines, Inc. and Allegro MicroSystems Philippines Realty, Inc. in favor of Equitable PCI Bank. |
II-1
Exhibit |
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Number
|
Description
|
|||
10 | .22** | Mortgage, dated May 4, 2004, executed by Allegro MicroSystems Philippines, Inc. and Allegro MicroSystems Philippines Realty, Inc. in favor of Equitable PCI Bank. | ||
10 | .23 | Agreement, dated December 28, 2006, among Sharp Corporation, Sanken Electric Co., Ltd. and the registrant. | ||
10 | .24 | Agreement, dated December 28, 2006, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .25** | Executive Deferred Compensation Plan, as amended and restated as of October 1, 2007. | ||
10 | .26** | Severance Agreement, dated October 3, 2007, between the registrant and Dennis H. Fitzgerald. | ||
10 | .27** | Severance Agreement, dated October 3, 2007, between the registrant and Mark A. Feragne. | ||
21 | .1** | List of subsidiaries of the registrant. | ||
23 | .1** | Consent of Ernst & Young LLP. | ||
23 | .2* | Consent of Sidley Austin llp (included in Exhibit 5.1). | ||
24 | .1** | Powers of Attorney (see signature pages of Form S-1, dated August 8, 2007, and Amendment No. 1 to Form S-1, dated November 30, 2007). |
* | To be filed by amendment. | |
** | Previously filed. | |
| Confidential treatment requested as to certain portions, which portions have been filed separately with the Securities and Exchange Commission by Allegro MicroSystems, Inc. |
II-2
By: |
/s/ DENNIS
H. FITZGERALD
|
Title: | President and Chief Executive Officer, |
Signature | Title | Date | ||||
/s/ DENNIS
H. FITZGERALD Dennis H. Fitzgerald |
President and Chief Executive Officer, Director (Principal Executive Officer) |
March 7, 2008 | ||||
/s/ MARK
A. FERAGNE Mark A. Feragne |
Vice President and Chief Financial Officer (Principal Financial and Accounting Officer) |
March 7, 2008 | ||||
* Sadatoshi Iijima |
Chairman of the Board | March 7, 2008 | ||||
* Kiyoshi Imaizumi |
Director | March 7, 2008 | ||||
* Hidejiro Akiyama |
Director | March 7, 2008 | ||||
* Yoshihiro Suzuki |
Director | March 7, 2008 | ||||
* Richard R. Lury |
Director | March 7, 2008 | ||||
* John H. MacKinnon |
Director | March 7, 2008 | ||||
*By: |
/s/ DENNIS
H. FITZGERALD Attorney-in-fact |
II-3
Exhibit |
||||
Number
|
Description
|
|||
1 | .1* | Form of Underwriting Agreement. | ||
3 | .1** | Amended and Restated Certificate of Incorporation of the registrant. | ||
3 | .2** | Amended and Restated By-laws of the registrant. | ||
4 | .1* | Form of registrants Common Stock Certificate. | ||
5 | .1* | Opinion of Sidley Austin llp. | ||
10 | .1** | 2001 Stock Option Plan and form of agreements thereunder. | ||
10 | .2** | 2007 Long-Term Incentive Plan. | ||
10 | .3** | Executive Deferred Compensation Plan for the registrant. | ||
10 | .4** | Severance Agreement, dated March 30, 2001, between the registrant and Dennis H. Fitzgerald and Letter Agreement, dated June 27, 2003, between the registrant and Dennis H. Fitzgerald, entered in relation thereto. | ||
10 | .5** | Affiliation Agreement, dated October 3, 2007, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .6 | Distribution Agreement Japan, dated July 5, 2007, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .7 | Distribution Agreement, dated July 5, 2007, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .8 | Sales Representative Agreement, dated July 5, 2007, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .9 | Wafer Foundry Agreement, dated August 1, 2007, between the registrant and Polar Semiconductor, Inc. | ||
10 | .10 | Joint Technology Development Agreement, effective as of September 13, 2007, among Polar Semiconductor, Inc., Sanken Electric Co., Ltd. and the registrant. | ||
10 | .11 | Technology Development Agreement, dated November 6, 2001, between PolarFab, Inc. (now known as Polar Semiconductor, Inc.) and the registrant. | ||
10 | .12 | Technology Transfer Agreement, dated November 30, 2002, between the registrant and Sanken Electric Co., Ltd. | ||
10 | .13** | Letter of Consent/Coexistence Agreement, dated October 3, 2006, between Cadence Design Systems, Inc. and the registrant. | ||
10 | .14** | Lease Agreement, dated August 19, 2003, between Airtight II, LLC and the registrant. | ||
10 | .15** | Contract of Lease, dated October , 2000, between the Government of the Republic of the Philippines and Allegro MicroSystems Philippines, Inc. | ||
10 | .16** | Contract of Lease, dated April 1, 2004, between Allegro MicroSystems Philippines Realty, Inc. and Allegro MicroSystems Philippines, Inc. | ||
10 | .17** | Loan Agreement, dated April 12, 2004, between the registrant and Sanken Electric Co., Ltd. and Memorandum, dated June 30, 2006, entered in relation thereto. | ||
10 | .18** | Loan Agreement, dated July 13, 2005, between the registrant and Sanken Electric Co., Ltd. and Memorandum, dated June 30, 2006, entered in relation thereto. | ||
10 | .19** | Loan Agreement, dated January 26, 2007, between the registrant and Sanken Electric Co., Ltd. | ||
10 | .20** | Loan Agreement, dated October 10, 2003, between Allegro MicroSystems Philippines, Inc. and Equitable PCI Bank. | ||
10 | .21** | Deed of Undertaking, dated October 10, 2003, entered by Allegro MicroSystems Philippines, Inc. and Allegro MicroSystems Philippines Realty, Inc. in favor of Equitable PCI Bank. | ||
10 | .22** | Mortgage, dated May 4, 2004, executed by Allegro MicroSystems Philippines, Inc. and Allegro MicroSystems Philippines Realty, Inc. in favor of Equitable PCI Bank. | ||
10 | .23 | Agreement, dated December 28, 2006, among Sharp Corporation, Sanken Electric Co., Ltd. and the registrant. | ||
10 | .24 | Agreement, dated December 28, 2006, between Sanken Electric Co., Ltd. and the registrant. | ||
10 | .25** | Executive Deferred Compensation Plan, as amended and restated as of October 1, 2007. |
II-4
Exhibit |
||||
Number
|
Description
|
|||
10 | .26** | Severance Agreement, dated October 3, 2007, between the registrant and Dennis H. Fitzgerald. | ||
10 | .27** | Severance Agreement, dated October 3, 2007, between the registrant and Mark A. Feragne. | ||
21 | .1** | List of subsidiaries of the registrant. | ||
23 | .1** | Consent of Ernst & Young LLP. | ||
23 | .2* | Consent of Sidley Austin llp (included in Exhibit 5.1). | ||
24 | .1** | Powers of Attorney (see signature pages of Form S-1, dated August 8, 2007, and Amendment No. 1 to Form S-1, dated November 30, 2007). |
* | To be filed by amendment. | |
** | Previously filed. | |
| Confidential treatment requested as to certain portions, which portions have been filed separately with the Securities and Exchange Commission by Allegro MicroSystems, Inc. |
II-5